Master Bond EP62-1LPSP optically clear, low viscosity epoxy delivers an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications.
- Provides high tensile and tensile lap shear strength exceeding 2,000 psi
- Bonds well to variety of substrates including metals, composites, glass and many plastics
- Offers non-critical four to one mix ratio by weight and open time of 12 to 24 hours at ambient temperatures
- Thin mixed viscosity of 150 to 300 cps can be further lowered by adding heat
- Low exotherm while curing allows it to be used for large encapsulations
- Provides various cure schedules
- Can be cured at temperatures as low as 60 to 70 C
- Faster cures can be achieved at 125 C
- Features glass transition temperature of greater than 125 C
- Thermally stable
- Serviceable over wide temperature range of -60 to 400 F
- Withstands exposure to chemicals such as water, fuels, oils, solvents, acids and bases
- Reliable electrical insulator and has a volume resistivity over 1014 ohm-cm
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